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Leaderone L1 detection system ensures that the quality of each electronic component is reliable

Leaderone not only has an independent anti-counterfeiting testing laboratory, but also is equipped with advanced high-precision testing equipment, and constantly updates these devices to maintain a leading position in the industry both domestically and internationally. We have adopted various methods such as destructive, non-destructive, and customized testing solutions to meet the needs of different customers. All products will undergo strict multi-step inspection procedures to ensure that our customers only receive genuine functional electronic components. It is under such high standards and strict requirements that the L1 detection system was born, further strengthening our detection capabilities.

Star Quality Inspection Framework

Leaderone selects electronic components from certified and reputable suppliers. We implement a strict supplier rating system to ensure that the components we receive are of high quality, while continuously evaluating, classifying, and monitoring all suppliers to continuously improve the quality initiatives we have promoted over the years and align with industry best practices.

  • 01

    Labelling and Packaging Verification

  • 02

    Visual and Marking inspection

  • 03

    Functional and Reliability Testing

  • 04

    Third Party Inspection

Visual Inspection

  • Package

    Packaging integrity, consistency between packaging layers, and accuracy of moisture-proof materials and desiccants included.

  • Label

    Verify product branding, model, count, batch number, manufacture date, origin, moisture sensitivity, and environmental compliance against the company's database.

  • Packaging Method

    Verify compliance of tape, tray, and tube packaging methods with specifications and industry regulations.

  • Dimensions

    Assess device's primary external dimensions for specification tolerance adherence.

  • Pins

    Inspect pin terminals and BGA balls for specification conformity and detect defects such as scratches, deformations, absence, and oxidation.

Remarking/Resurfacing Test

  • Solvent Test

    Apply designated solvent to device markings and assess wiped areas and swab residue to verify against remarking or resurfacing.

  • Scratch Test

    Perform scratch tests on device surfaces with a blade to ascertain the presence of secondary coatings.

Electrical Test

  • Insulation Resistance Test

    The insulation resistance test applies specified voltage to quantify MLCC insulation resistance in Ohms.

  • LCR Test

    The LCR meter is utilized for measuring a conductor's R, C, and L, along with complex impedance parameters including |Z|, |Y|, D, Q, X, B, and ∅.

  • Discrete Test

    Discrete testing evaluates IGBT, MOSFET, and diode electrical characteristics, encompassing Open/Short testing and I/V curve analysis.

Solderability Test

  • Solderability Test

    Utilize JESD22-B102E and the dip-and-look technique for solderability testing of leaded and leadless components to mitigate defects due to oxidation or contamination.

Nondestructive Test

  • X-Ray Fluorescence

    X-Ray fluorescence (XRF) is employed for material analysis to ascertain the elemental composition, particularly for quantifying RoHS-regulated elements, and to identify localized elemental discrepancies against reference samples or datasheets.

  • X-Ray Test

    X-ray testing is a non-destructive radiographic technique for internal structure validation, confirming die presence, bond wire integrity, leadframe alignment, and consistency across components or against known good samples.

Destructive Test

  • Chemical Decapsulation

    Chemical decapsulation entails the selective removal of encapsulant within a secure chamber to reveal the internal die structure, facilitated by the application of specific acid formulations. This process enables the inspection and verification of die integrity, interconnectivity, manufacturer identification, surface morphology, and dimensional accuracy.

Inspection Standard

Our testing protocols are aligned with global electronic component testing benchmarks, including the IDEA-STD-1010-B and IPC-A-610 standards, complemented by industry-wide practices and proprietary expertise developed over multiple years. We are committed to the relentless pursuit of precision and excellence in product quality.

Third Party Testing

To mitigate financial damages stemming from counterfeit and substandard semiconductor products, Leaderone has established strategic partnerships with accredited third-party testing entities and esteemed laboratories to offer comprehensive and specialized testing services.

  • Cross-Section
  • Reliability Test
  • Heated Solvent Test
  • Thermal Cycling Test
  • Component Failure Analysis
  • Scanning Acoustic Microscopy (SAM)
  • Energy Dispersive X-Ray/Spectrometry (EDX)
  • Scanning Electron Microscopy (SEM)
    • External Visual Inspection (EVI)
    • Material Analysis (XRF)
    • X-Ray
    • Decapsulation
    • Scanning Acoustic Microscopy
    • Electrical Test
    • Endurance Test
    • Analysis and Investigation
    • ......
    • Permanency Test
    • Test Solderability
    • Reliability Test
    • Authenticity Analysis
    • IC Verification Test
    • Key Function Test
    • RoHS Test
    • Pb Free Test
    • ......